Epoxy 711 Adhesive Formula

Component dosage /g component dosage /g
A , E-44 epoxy resin 40 dioctyl sebacate 10
E-42 epoxy resin 40 B , polyamide 651 38.5
Epoxy thinner 600 20 A : B=100 : 35
Preparation and curing    According to the amount of weighing in order, can be mixed evenly. Validity period: 25 °C, 50g , 2 ~ 3h ; Curing: 24h at 25 °C, or 2h at 80 °C.
use   The glue is used at -40 ~ 50 °C for bonding of metals, plastics, ceramics, etc.