[Formula 1]
Ethylene-vinyl acetate copolymer 100 Coumarone-indrene resin 25 Synthetic paraffin resin 7
Talc 20 2,6-di-tert-butyl p-cresol 1
This formula is a general-purpose type, softening temperature 72-80 °C, embrittlement temperature below -40 °C, long-term use in -40-60 °C. It has good bonding performance for various materials, especially for some difficult-to-stick plastics with high bonding strength.
[Formula 2]
Ethylene-vinyl acetate copolymer 100 Butyl rubber 30 Butylphenol resin 20
Dibutyl phthalate 5 Calcium carbonate 5
The matrix of this formula is a low molecular weight ethylene-vinyl acetate copolymer with a vinyl acetate content of 28%. The butyl rubber is added to improve the flexibility and elasticity of the glue, increase the bonding strength, and shorten the curing time.
[Formula 3]
Vinyl pyrrolidone-vinyl acetate copolymer 100 Castor oil hydrogenated compound 4
Water-soluble polyethylene glycol wax 2.5 Epoxy resin 1.6 2,6-di-tert-butyl p-cresol 1.4
This formula is a water soluble hot melt adhesive. The matrix is ​​a pyrrolidone-modified ethylene-vinyl acetate copolymer. Larger molecular weight, higher bonding strength. The compatibility with general wax compounds is poor, and the addition of water-soluble polyethylene glycol wax greatly improves the compatibility. It is mainly used for bonding of porous materials such as wood, ceramics, concrete components, fabrics, and paper, and can also be used as a primer for other adhesives.
[Formula 4]
Ethylene-vinyl acetate copolymer 100 Rosin 75 Barium sulfate 75 Antioxidant 1.25
The matrix in this formulation is an ethylene-vinyl acetate copolymer with a melt index of 24 and a vinyl acetate content of 32%. It is mainly used for edge-sealing of wood-based panels.
[Formula 5]
Ethylene-vinyl acetate copolymer 100 Paraffin 20 Polymerized rosin (softening point >120°C) 30
N-Phenyl-β-Naphthylamine 1
The base vinyl acetate content of this formula is greater than 28%. It can be melted and coated at about 230°C. It is mainly used for splicing veneer lumber and also for impregnating glass fiber.
[Formulation 6]
Vinyl Acetate Copolymer 70 Butyl Rubber 30 Antioxidant 0.25
This formulation is a low melting viscosity hot melt adhesive with a melt viscosity of 40 Pa.s at 200°C and an elongation of 30%. Has excellent coating properties and viscoelasticity.
[Formula 7]
Ethylene-vinyl acetate-acrylate copolymer 50 Ethylene-vinyl chloride copolymer 50
Polyethylene powder 100 aluminum hydroxide 300
This formula is mainly used for carpet backing glued. The coating amount is 350g/m2. Adhesive strength of 5.5N/cm, with excellent heat resistance and flame retardant.
[Formula 8]
Polyamide resin 89 triphenyl phosphate 9 paraffin 2
This formula is a universal polyamide hot melt adhesive. The medium softening point polyamide resin is used as a matrix and can be used at a temperature of 140-160° C. for a long period of time. The coating properties in a heated and molten state are good, the viscosity is small, and the curing speed is fast. If you need to further improve the fluidity of the glue, you can also increase the amount of wax. It is mainly used for bonding of wood, ceramics, paper, fabric, brass, aluminum alloy, bakelite and various plastics.
[Formula 9]
Low softening point polyamide resin 67.31 Low softening point polyamide resin 3.85 Polyethylene 3.85
Dibutyl Phthalate 9.65 Bisphenol A Epoxy Resin 1.92 Rosin Resin 13.42
This formula is a cold-resistant hot melt adhesive. Polyamide resins with a low softening point (105-115°C) and an ultra-low softening point (43°C) are used as the matrix. It has good low temperature flexibility and flexibility, and it has good bonding performance to difficult-to-bond plastics such as polyethylene and polypropylene.
[Formula 10]
Polyamide Resin 100 Polymerized Rosin 30 Paraffin 20
N-Phenyl-β-naphthylamine 1 N-ethyl methyl benzene sulfonamide 10
In this formulation, the softening point of the matrix is ​​170-180°C. It is mainly used for melting dip-coated glass fiber to make hot-melt adhesive line, used for veneer splicing in wood processing, and also used for bonding other porous materials and plastics.
[Formula 11]
Nylon Copolymer Powder 100 Sodium Polyacrylate 50 Oxalic Acid 0.05 Water 120
This formula is a paste hot melt adhesive. The common hot melt adhesives are in the form of films, powders, strips, etc., which have the disadvantages of inconvenient use, powder flying, difficulty in adjusting the amount of the powder, and the like. Paste hot melt adhesives make up for these deficiencies, and the bond strength has not substantially decreased. It is also water insoluble. If used for bonding cotton fabrics, it can be coated at 150°C, bonding strength can reach 9.3N/cm after 5s.
[Formulation 12]
Polyester resin 100 Polystyrene resin 35 Xylene resin 20 Talc 12
2,6-di-tert-butyl p-cresol 1.5
This formula is a polyester hot melt adhesive. Due to the addition of homogeneous polystyrene resin, the melt viscosity of the substrate is reduced, and the construction performance is better. The polyester resin obtained by the polycondensation reaction of dimethyl terephthalate, isophthalic acid, sebacic acid, and 1,4-butanediol in the softening point of the matrix has a softening point of approximately 120°C. This formula has high bonding strength and good bonding effect on wood, leather, fabric, cardboard, plastics, etc., especially for the flexible plate can show its advantages. For metal bonding, good initial tack and bonding properties can be achieved.
[Formula 13]
Polyester resin 100 Petroleum resin 20 Oil-soluble phenolic resin 20 Talc 10
Diphenyl octyl phosphite 1
The matrix of this formulation is a highly viscous polyester resin obtained by the polycondensation reaction of hexahydroisophthalic acid, terephthalic acid, isophthalic acid, and 1,4-butanediol. Petroleum resin is a copolymer of C4-C5 and C9 fractions and has good compatibility. Operating temperature range -40-200 °C.
[Formula 14]
Polyethylene glycol adipate (M=2000) 1 (mol) 1,4-butanediol 2 (mol)
Diphenylmethane diisocyanate (MDI) 3 (mol)
This formula is a polyurethane hot melt adhesive. The softening point is 130°C. Mainly used for fabric bonding. Film tensile strength 30MPa, elongation 600%. Bonded fabric peel strength 250-350N/cm. Excellent resistance to hot water and moisture and heat aging.
[Formula 15]
A polypropylene glycol 128 toluene diisocyanate 62
Part B epoxy resin 357 dicyandiamide 6
This formula is a reactive polyurethane hot melt adhesive. The glue ratio is A:B=1:2, which is a thermoplastic polyurethane containing epoxy side chains. The two components of A and B can be obtained by reacting at 80°C for 1 hour. During construction, the adhesive was melt-coated on the adhesive surface at 125°C, laminated and cured at 160°C for 30 minutes. Adhesive strength 22.5MPa.
Ethylene-vinyl acetate copolymer 100 Coumarone-indrene resin 25 Synthetic paraffin resin 7
Talc 20 2,6-di-tert-butyl p-cresol 1
This formula is a general-purpose type, softening temperature 72-80 °C, embrittlement temperature below -40 °C, long-term use in -40-60 °C. It has good bonding performance for various materials, especially for some difficult-to-stick plastics with high bonding strength.
[Formula 2]
Ethylene-vinyl acetate copolymer 100 Butyl rubber 30 Butylphenol resin 20
Dibutyl phthalate 5 Calcium carbonate 5
The matrix of this formula is a low molecular weight ethylene-vinyl acetate copolymer with a vinyl acetate content of 28%. The butyl rubber is added to improve the flexibility and elasticity of the glue, increase the bonding strength, and shorten the curing time.
[Formula 3]
Vinyl pyrrolidone-vinyl acetate copolymer 100 Castor oil hydrogenated compound 4
Water-soluble polyethylene glycol wax 2.5 Epoxy resin 1.6 2,6-di-tert-butyl p-cresol 1.4
This formula is a water soluble hot melt adhesive. The matrix is ​​a pyrrolidone-modified ethylene-vinyl acetate copolymer. Larger molecular weight, higher bonding strength. The compatibility with general wax compounds is poor, and the addition of water-soluble polyethylene glycol wax greatly improves the compatibility. It is mainly used for bonding of porous materials such as wood, ceramics, concrete components, fabrics, and paper, and can also be used as a primer for other adhesives.
[Formula 4]
Ethylene-vinyl acetate copolymer 100 Rosin 75 Barium sulfate 75 Antioxidant 1.25
The matrix in this formulation is an ethylene-vinyl acetate copolymer with a melt index of 24 and a vinyl acetate content of 32%. It is mainly used for edge-sealing of wood-based panels.
[Formula 5]
Ethylene-vinyl acetate copolymer 100 Paraffin 20 Polymerized rosin (softening point >120°C) 30
N-Phenyl-β-Naphthylamine 1
The base vinyl acetate content of this formula is greater than 28%. It can be melted and coated at about 230°C. It is mainly used for splicing veneer lumber and also for impregnating glass fiber.
[Formulation 6]
Vinyl Acetate Copolymer 70 Butyl Rubber 30 Antioxidant 0.25
This formulation is a low melting viscosity hot melt adhesive with a melt viscosity of 40 Pa.s at 200°C and an elongation of 30%. Has excellent coating properties and viscoelasticity.
[Formula 7]
Ethylene-vinyl acetate-acrylate copolymer 50 Ethylene-vinyl chloride copolymer 50
Polyethylene powder 100 aluminum hydroxide 300
This formula is mainly used for carpet backing glued. The coating amount is 350g/m2. Adhesive strength of 5.5N/cm, with excellent heat resistance and flame retardant.
[Formula 8]
Polyamide resin 89 triphenyl phosphate 9 paraffin 2
This formula is a universal polyamide hot melt adhesive. The medium softening point polyamide resin is used as a matrix and can be used at a temperature of 140-160° C. for a long period of time. The coating properties in a heated and molten state are good, the viscosity is small, and the curing speed is fast. If you need to further improve the fluidity of the glue, you can also increase the amount of wax. It is mainly used for bonding of wood, ceramics, paper, fabric, brass, aluminum alloy, bakelite and various plastics.
[Formula 9]
Low softening point polyamide resin 67.31 Low softening point polyamide resin 3.85 Polyethylene 3.85
Dibutyl Phthalate 9.65 Bisphenol A Epoxy Resin 1.92 Rosin Resin 13.42
This formula is a cold-resistant hot melt adhesive. Polyamide resins with a low softening point (105-115°C) and an ultra-low softening point (43°C) are used as the matrix. It has good low temperature flexibility and flexibility, and it has good bonding performance to difficult-to-bond plastics such as polyethylene and polypropylene.
[Formula 10]
Polyamide Resin 100 Polymerized Rosin 30 Paraffin 20
N-Phenyl-β-naphthylamine 1 N-ethyl methyl benzene sulfonamide 10
In this formulation, the softening point of the matrix is ​​170-180°C. It is mainly used for melting dip-coated glass fiber to make hot-melt adhesive line, used for veneer splicing in wood processing, and also used for bonding other porous materials and plastics.
[Formula 11]
Nylon Copolymer Powder 100 Sodium Polyacrylate 50 Oxalic Acid 0.05 Water 120
This formula is a paste hot melt adhesive. The common hot melt adhesives are in the form of films, powders, strips, etc., which have the disadvantages of inconvenient use, powder flying, difficulty in adjusting the amount of the powder, and the like. Paste hot melt adhesives make up for these deficiencies, and the bond strength has not substantially decreased. It is also water insoluble. If used for bonding cotton fabrics, it can be coated at 150°C, bonding strength can reach 9.3N/cm after 5s.
[Formulation 12]
Polyester resin 100 Polystyrene resin 35 Xylene resin 20 Talc 12
2,6-di-tert-butyl p-cresol 1.5
This formula is a polyester hot melt adhesive. Due to the addition of homogeneous polystyrene resin, the melt viscosity of the substrate is reduced, and the construction performance is better. The polyester resin obtained by the polycondensation reaction of dimethyl terephthalate, isophthalic acid, sebacic acid, and 1,4-butanediol in the softening point of the matrix has a softening point of approximately 120°C. This formula has high bonding strength and good bonding effect on wood, leather, fabric, cardboard, plastics, etc., especially for the flexible plate can show its advantages. For metal bonding, good initial tack and bonding properties can be achieved.
[Formula 13]
Polyester resin 100 Petroleum resin 20 Oil-soluble phenolic resin 20 Talc 10
Diphenyl octyl phosphite 1
The matrix of this formulation is a highly viscous polyester resin obtained by the polycondensation reaction of hexahydroisophthalic acid, terephthalic acid, isophthalic acid, and 1,4-butanediol. Petroleum resin is a copolymer of C4-C5 and C9 fractions and has good compatibility. Operating temperature range -40-200 °C.
[Formula 14]
Polyethylene glycol adipate (M=2000) 1 (mol) 1,4-butanediol 2 (mol)
Diphenylmethane diisocyanate (MDI) 3 (mol)
This formula is a polyurethane hot melt adhesive. The softening point is 130°C. Mainly used for fabric bonding. Film tensile strength 30MPa, elongation 600%. Bonded fabric peel strength 250-350N/cm. Excellent resistance to hot water and moisture and heat aging.
[Formula 15]
A polypropylene glycol 128 toluene diisocyanate 62
Part B epoxy resin 357 dicyandiamide 6
This formula is a reactive polyurethane hot melt adhesive. The glue ratio is A:B=1:2, which is a thermoplastic polyurethane containing epoxy side chains. The two components of A and B can be obtained by reacting at 80°C for 1 hour. During construction, the adhesive was melt-coated on the adhesive surface at 125°C, laminated and cured at 160°C for 30 minutes. Adhesive strength 22.5MPa.