The ring-opening reactivity of epoxy resins is determined by the electronic effect of the substituents. For example, the addition of a hydroxyl-containing material (hydroxymethyl) can promote the ring opening of the epoxy:
(1) Addition of 25% resorcinol in bisphenol A epoxy and poly ethylene polyamine systems can increase the reaction rate by a factor of 10; if methylol is directly introduced into the structure of epoxy resin, the reaction rate will be Increase in tens of times. E.g:
712# and 618# Glue Performance Comparison Component Curing Condition Shear (kg/cm2) 60°C Shear 712#
100200# Polyamide 100 Epoxidized Polysulfide 20600# Thinner 10 28—30°C 5H 177 22 30—35°C 5H 311 34 618# More than 100 Ibid 28–30°C 5H 22 0 712#
100 Epoxidized polythiourea 20651 Polyamide 120600# 20 -5--14°C 7 days 306 52 (2) Epoxidized phenolic aldehyde has a promoting effect due to hydroxymethyl and phenol groups.
Formula one:
509# epoxidized phenolic 100 100 butanediol diglycidyl ether 20
2E4BZ (2-ethyl 4-methylimidazole) 6 2#Sio2 3 Room temperature Ï„FeFe=100kg/cm 2
1, low temperature cryogenic rubber adhesive 3 # <br> formula II:
Tetrahydrofuran polyether epoxy 5 590# curing agent 1 KH-550 0.2
Curing conditions: pressure 0.5 kg/cm2 at 30 °C for 30 hours for ultra-low temperature (-196 °C) metal bonding, at -196 °C, τAL-AL = 210 kg/cm2
Formula 3:
D-11# Epoxy Glue 6101# Epoxy 120 200# Polyamide 100 600# Thinner 24
M-phenylenediamine 6.5 at 20°C τAL/AL=200 kg/cm2 KH-550 2.5
Curing conditions: pressure 0.5 kg/cm2
24 to 36 hours at 20°C at -120°C τAL/AL=150 kg/cm2
Applicable to -120 °C ~ +60 °C metal bonding.
Formula 4:
HY-912 # plastic group: E-51 (618#) 100 2E4BZ 4
Group B: 241# Polyester 100 2,4 Toluene diisocyanate 8.5
Group C: Aluminum powder curing conditions: 0.5 kg/cm2, 25°C, 48-72h A: B: C=60:40:4
Applicable -190 ~ +100 °C metal bonding °C -190 20 50 (1MPa = 10) kg/cm2 AL/AL 15.4 21.7 4.7 2, high temperature adhesives <br> In the preparation of high temperature adhesives, the main way to change the high temperature resistant resin Epoxy resin or synthetic new high temperature epoxy resin.
2.1 phenolic resin modified epoxy resin:
The modified rubber can withstand high temperature of 260°C and the shear strength reaches 10MPa. For example:
Formula 5:
Bisphenol A Epoxy Resin (K=0.18—0.22) 49 Phenolic Resin 100 Aluminum Powder 149 Cyanocyanamide 9
8-hydroxyquinoline copper 1.5 (antioxidant)
2.2 Polysulfone modified epoxy resin polysulfone resin:
Formula 6:
D -19 # plastic 618 # 100 polysulfone (η = 0.4-0.7) 50 dicyandiamide 11
Dimethylformamide (solvent) 25 CCl3 (solvent) 150
Curing conditions: 0.5 kg/cm2, 180°C, 3H
Τ30# chromium molybdenum steel = 300-330 kg/cm2 (tested at 120°C)
2.3 silicone-modified epoxy resin adhesive <br> formula VII:
Epoxidized phenolic resin 100 Bisphenol A - Organosilicon condensate 33 AS2O5 32 Aluminum powder 126
316 °C stainless steel = 85 kg/cm2, aging 200 hours after the τ steel is 53 kg/cm2, in the formula by adding AS2O5 is both an antioxidant and a curing agent, can form Si-O-AS bond.
More than 2.4 functional epoxy <br> formula VIII:
KH-509# high temperature adhesive 509# epoxidized phenolic 100 647 anhydride 80
TiO2 (200 mesh) 50 Glass powder (200 mesh) 50
Curing conditions: 150 °C/3h + 200 °C/2h 200 °C aging 400H AL / AL is 94 kg / cm2; 250 °C aging 200H, the τAL / AL is still 55 kg / cm2.
Formula 9:
High-temperature structural adhesive diaminodiphenyl ether multi-functional epoxy 100 liquid nitrile rubber 8-10
704 curing agent 10 iron powder (300-400 mesh) 20
Curing conditions: 0.5 kg/cm2, 20°C/24h + 80°C/4h τFeFe = 42-56MPa, suitable for cast iron bonding.
3, water curing glue (water absorption glue)
Formula 10:
E-44# 100 702# Polyester 10-20 DTA (Diethylenetriamine) 10
Petroleum sulfonic acid 5 Quicklime (160 mesh) 50
Curing conditions: water = 17-20MPa τ 20-30 ℃ is applicable to underwater repair <br> formula XI:
E-42# 100 Ethylenediamine Carbamate 15 Quicklime 40 Slaked Lime 20
Asbestos powder 20 Ï„Fe=15MPa H2O 10
Ethylenediamine carbamate absorbs water and decomposes ethylenediamine, reacts with epoxy resin, cures at room temperature and cures at 24H, and is suitable for underwater bonding.
Formula 12:
E-44# 100 Ketimine 20 Quicklime 500 H2O 5
Ketimine absorbs water and decomposes into aldimine resin and methyl isobutyl ketone, aldimine resin and epoxy resin curing reaction. <br> formulations suitable for curing thirteen water:
E-44# 100 Ketimine 40 Polysulfide 20 Quicklime 10
Room temperature water absorption curing 28h, Ï„fe = 12MPa
4, conductive adhesive <br> formula 14:
305# conductive adhesive 420# nylon epoxy 1
Reducing silver powder 3 Solvent (methanol: benzene = 7:2) Appropriate amount of curing conditions: 1-3 kg/cm2, 160°C curing 1-2h τ room temperature = 26.3MPa τ-60°C = 31.5MPa
τ120 ℃ = 9.1MPa <br> adhesive formulations for metal fifteen:
SY-11 plastic 618# 100 triethanolamine 15 silver powder 200-260
Curing temperature 120 80 45 Resistivity 2×10-4 5×10-3 10-3 MPa 17.1 16.0 Curing conditions: 0.5 kg/cm2, 120°C 3H or 45°C 72h Suitable for Titanium Chloride piezoelectric body, carbon Bonding with superfine wire.
Formula 16:
HXY-13 E-51 100 200# Polyamide 50 I Phenylenediamine 7.5 Precipitated Silver 450
Curing conditions: 80 °C, 3h resistivity 1.5-5.7 × 1025L · cm τ-40 °C> 100MPa τ20 °C> 10MPa Suitable for electronic components bonding.
Formula 17:
DAD-5 glue AG-80# epoxy resin 100 liquid nitrile rubber 15 2E4BZ 15 electrolytic silver powder 250
Curing conditions: 5 - 10MPa 100 °C, 3h τ room temperature = 15MPa τ200 °C = 11MPa for electronic components bonding.
Formula 18:
E-44#100 Dibutyl phthalate 20 DTA (Diethylenetriamine) 12 KH-550 13
Curing conditions: room temperature 4h, or 80 °C, 3h τ room temperature = 10-12MPa resistivity 1.2-0.6 × 10-2cm for -50 ~ 120 °C electronic copper powder (200-300 mesh) 600 element bonding.
Formula 19:
E-42# 100 dibutyl phthalate 10 590# thinner 5 triethanolamine 15 silver powder 200-300
Curing conditions: 80 ℃ curing 4h, the resistivity of 1-4 × 10-4cm τ> 16MPa for electronic device bonding twenty <br> formula:
E-51# 70 660# Diluent 10 AG-80 Epoxy Resin 20 Triethanolamine 15 Carbon Black 75-100
Curing conditions: 80°C, 4h, resistivity 1-5×10-2cm τ>15MPa
Formula twenty-one:
HXJ-23 adhesive 509# phenolic epoxy 100 647# anhydride 68 copolydimethylamine 1 silver 300
100°C, 2H τμ/μ=4MPa Resistivity 3×10-3cm
Formula twenty-two:
701 Rubber 618# 100 B-63 Glycerol Epoxy 10-20 Dibutyl Phthalate 5-6
Hexamethylenediamine triethanol glue 13-15 Reduction silver powder 250-300
70-80 ℃, room temperature curing 1h = 22.3MPa δ = 50MPa resistivity of 3 × 10-2cm glass tube suitable aluminum copper <br> electronic component adhesive formulation twenty-three:
618# 100 F-70# Epoxy Resin 40 Liquid Acrylonitrile 25 2E4BZ 4 647# Anhydride 120
KH-50 4 Silver 550-600
120°C, curing 3h τ=19MPa τ-60°C=17.8MPa resistivity 10-3-10-4cm
Formula twenty-four:
618# 80 E-35# epoxy resin 70 AG-80# 50 liquid nitrile 60 dicyandiamide 20 silver powder 600
80°C curing 2h τ=20MPa Resistivity 1-3×10-3 cm
Formula 25:
D-17 adhesive 618# 70 W-95 epoxy 30 polyvinyl butyral 7 600# thinner 10
CTBN 10 Phenylenediamine 20 2E4BZ 1.5 Reduction Silver 250-300
80°C, curing 2h τ=28MPa τ-52°C=29MPa τ100°C=25～28MPa τ150°C=7.5MPa
δ=74MPa The resistivity is 10-2 to 10-4cm
5, magnetic adhesive <br> formula twenty-six:
618# 185 Maleic anhydride 45 Hydroxy iron powder 770
Curing conditions: 125 ℃, 2h, suitable for transformer core glued <br> twenty-seven formula:
618# 100 Ferrite Powder (200 mesh) 20 DTA 10
Curing conditions: room temperature, 48H / 100 ℃, 2h, suitable for magnet glued <br> twenty-eight formula:
618# 100 Liquid Butyronitrile 15 Triethanolamine 15 Hydroxy Iron Powder 200-350
Curing conditions: 100 °C, 2h τ silicon steel> 18MPa
6, photosensitive adhesive <br> Photosensitive adhesive requires colorless, transparent, light-resistant, moisture-heat aging, curing shrinkage and high elongation, used to glue optical transparent components (chain) of the special glue.
Several chemical glue comparison Type Advantages Disadvantages Improvement measures Room temperature heating Organic silicones Good elasticity, high light transmittance, good resistance to aging, Low bonding strength Treatment of optical components with KH-550 Surface acrylic resin High optical shrinkage With KH-570 with polyurethane adhesive Optical and toughness are not good resistance to aging Add H12MDI improve epoxy glue good optical, good aging resistance, small elongation, small elongation with KH-560 treatment Note: H12MDI is hydrogenated 4,4 '-diisocyanate diphenyl alkane.
Formula 29:
GM-924 Photosensitive adhesive 711# Epoxy 60 Methyl methacrylate 40 Ï„AL/Perspex 6MPa
Curing conditions: 80W high-pressure chandeliers (distance 4 cm) Benzophenone 1.5 irradiation for 3 minutes. Suitable for bonding pieces of plexiglass <br> thirty formula:
Epoxy acrylate 100 DAP (ortho-benzoate) 30 benzoin Ether-ether DBP (dibutyl phthalate) 5
Ultraviolet radiation curing for 2 minutes, and ceramic peeling strength of 7.4MPa, bonding ceramic resonator LD and color TV, hydroquinone 0.075 delay line and so on.
(1) Addition of 25% resorcinol in bisphenol A epoxy and poly ethylene polyamine systems can increase the reaction rate by a factor of 10; if methylol is directly introduced into the structure of epoxy resin, the reaction rate will be Increase in tens of times. E.g:
712# and 618# Glue Performance Comparison Component Curing Condition Shear (kg/cm2) 60°C Shear 712#
100200# Polyamide 100 Epoxidized Polysulfide 20600# Thinner 10 28—30°C 5H 177 22 30—35°C 5H 311 34 618# More than 100 Ibid 28–30°C 5H 22 0 712#
100 Epoxidized polythiourea 20651 Polyamide 120600# 20 -5--14°C 7 days 306 52 (2) Epoxidized phenolic aldehyde has a promoting effect due to hydroxymethyl and phenol groups.
Formula one:
509# epoxidized phenolic 100 100 butanediol diglycidyl ether 20
2E4BZ (2-ethyl 4-methylimidazole) 6 2#Sio2 3 Room temperature Ï„FeFe=100kg/cm 2
1, low temperature cryogenic rubber adhesive 3 # <br> formula II:
Tetrahydrofuran polyether epoxy 5 590# curing agent 1 KH-550 0.2
Curing conditions: pressure 0.5 kg/cm2 at 30 °C for 30 hours for ultra-low temperature (-196 °C) metal bonding, at -196 °C, τAL-AL = 210 kg/cm2
Formula 3:
D-11# Epoxy Glue 6101# Epoxy 120 200# Polyamide 100 600# Thinner 24
M-phenylenediamine 6.5 at 20°C τAL/AL=200 kg/cm2 KH-550 2.5
Curing conditions: pressure 0.5 kg/cm2
24 to 36 hours at 20°C at -120°C τAL/AL=150 kg/cm2
Applicable to -120 °C ~ +60 °C metal bonding.
Formula 4:
HY-912 # plastic group: E-51 (618#) 100 2E4BZ 4
Group B: 241# Polyester 100 2,4 Toluene diisocyanate 8.5
Group C: Aluminum powder curing conditions: 0.5 kg/cm2, 25°C, 48-72h A: B: C=60:40:4
Applicable -190 ~ +100 °C metal bonding °C -190 20 50 (1MPa = 10) kg/cm2 AL/AL 15.4 21.7 4.7 2, high temperature adhesives <br> In the preparation of high temperature adhesives, the main way to change the high temperature resistant resin Epoxy resin or synthetic new high temperature epoxy resin.
2.1 phenolic resin modified epoxy resin:
The modified rubber can withstand high temperature of 260°C and the shear strength reaches 10MPa. For example:
Formula 5:
Bisphenol A Epoxy Resin (K=0.18—0.22) 49 Phenolic Resin 100 Aluminum Powder 149 Cyanocyanamide 9
8-hydroxyquinoline copper 1.5 (antioxidant)
2.2 Polysulfone modified epoxy resin polysulfone resin:
Formula 6:
D -19 # plastic 618 # 100 polysulfone (η = 0.4-0.7) 50 dicyandiamide 11
Dimethylformamide (solvent) 25 CCl3 (solvent) 150
Curing conditions: 0.5 kg/cm2, 180°C, 3H
Τ30# chromium molybdenum steel = 300-330 kg/cm2 (tested at 120°C)
2.3 silicone-modified epoxy resin adhesive <br> formula VII:
Epoxidized phenolic resin 100 Bisphenol A - Organosilicon condensate 33 AS2O5 32 Aluminum powder 126
316 °C stainless steel = 85 kg/cm2, aging 200 hours after the τ steel is 53 kg/cm2, in the formula by adding AS2O5 is both an antioxidant and a curing agent, can form Si-O-AS bond.
More than 2.4 functional epoxy <br> formula VIII:
KH-509# high temperature adhesive 509# epoxidized phenolic 100 647 anhydride 80
TiO2 (200 mesh) 50 Glass powder (200 mesh) 50
Curing conditions: 150 °C/3h + 200 °C/2h 200 °C aging 400H AL / AL is 94 kg / cm2; 250 °C aging 200H, the τAL / AL is still 55 kg / cm2.
Formula 9:
High-temperature structural adhesive diaminodiphenyl ether multi-functional epoxy 100 liquid nitrile rubber 8-10
704 curing agent 10 iron powder (300-400 mesh) 20
Curing conditions: 0.5 kg/cm2, 20°C/24h + 80°C/4h τFeFe = 42-56MPa, suitable for cast iron bonding.
3, water curing glue (water absorption glue)
Formula 10:
E-44# 100 702# Polyester 10-20 DTA (Diethylenetriamine) 10
Petroleum sulfonic acid 5 Quicklime (160 mesh) 50
Curing conditions: water = 17-20MPa τ 20-30 ℃ is applicable to underwater repair <br> formula XI:
E-42# 100 Ethylenediamine Carbamate 15 Quicklime 40 Slaked Lime 20
Asbestos powder 20 Ï„Fe=15MPa H2O 10
Ethylenediamine carbamate absorbs water and decomposes ethylenediamine, reacts with epoxy resin, cures at room temperature and cures at 24H, and is suitable for underwater bonding.
Formula 12:
E-44# 100 Ketimine 20 Quicklime 500 H2O 5
Ketimine absorbs water and decomposes into aldimine resin and methyl isobutyl ketone, aldimine resin and epoxy resin curing reaction. <br> formulations suitable for curing thirteen water:
E-44# 100 Ketimine 40 Polysulfide 20 Quicklime 10
Room temperature water absorption curing 28h, Ï„fe = 12MPa
4, conductive adhesive <br> formula 14:
305# conductive adhesive 420# nylon epoxy 1
Reducing silver powder 3 Solvent (methanol: benzene = 7:2) Appropriate amount of curing conditions: 1-3 kg/cm2, 160°C curing 1-2h τ room temperature = 26.3MPa τ-60°C = 31.5MPa
τ120 ℃ = 9.1MPa <br> adhesive formulations for metal fifteen:
SY-11 plastic 618# 100 triethanolamine 15 silver powder 200-260
Curing temperature 120 80 45 Resistivity 2×10-4 5×10-3 10-3 MPa 17.1 16.0 Curing conditions: 0.5 kg/cm2, 120°C 3H or 45°C 72h Suitable for Titanium Chloride piezoelectric body, carbon Bonding with superfine wire.
Formula 16:
HXY-13 E-51 100 200# Polyamide 50 I Phenylenediamine 7.5 Precipitated Silver 450
Curing conditions: 80 °C, 3h resistivity 1.5-5.7 × 1025L · cm τ-40 °C> 100MPa τ20 °C> 10MPa Suitable for electronic components bonding.
Formula 17:
DAD-5 glue AG-80# epoxy resin 100 liquid nitrile rubber 15 2E4BZ 15 electrolytic silver powder 250
Curing conditions: 5 - 10MPa 100 °C, 3h τ room temperature = 15MPa τ200 °C = 11MPa for electronic components bonding.
Formula 18:
E-44#100 Dibutyl phthalate 20 DTA (Diethylenetriamine) 12 KH-550 13
Curing conditions: room temperature 4h, or 80 °C, 3h τ room temperature = 10-12MPa resistivity 1.2-0.6 × 10-2cm for -50 ~ 120 °C electronic copper powder (200-300 mesh) 600 element bonding.
Formula 19:
E-42# 100 dibutyl phthalate 10 590# thinner 5 triethanolamine 15 silver powder 200-300
Curing conditions: 80 ℃ curing 4h, the resistivity of 1-4 × 10-4cm τ> 16MPa for electronic device bonding twenty <br> formula:
E-51# 70 660# Diluent 10 AG-80 Epoxy Resin 20 Triethanolamine 15 Carbon Black 75-100
Curing conditions: 80°C, 4h, resistivity 1-5×10-2cm τ>15MPa
Formula twenty-one:
HXJ-23 adhesive 509# phenolic epoxy 100 647# anhydride 68 copolydimethylamine 1 silver 300
100°C, 2H τμ/μ=4MPa Resistivity 3×10-3cm
Formula twenty-two:
701 Rubber 618# 100 B-63 Glycerol Epoxy 10-20 Dibutyl Phthalate 5-6
Hexamethylenediamine triethanol glue 13-15 Reduction silver powder 250-300
70-80 ℃, room temperature curing 1h = 22.3MPa δ = 50MPa resistivity of 3 × 10-2cm glass tube suitable aluminum copper <br> electronic component adhesive formulation twenty-three:
618# 100 F-70# Epoxy Resin 40 Liquid Acrylonitrile 25 2E4BZ 4 647# Anhydride 120
KH-50 4 Silver 550-600
120°C, curing 3h τ=19MPa τ-60°C=17.8MPa resistivity 10-3-10-4cm
Formula twenty-four:
618# 80 E-35# epoxy resin 70 AG-80# 50 liquid nitrile 60 dicyandiamide 20 silver powder 600
80°C curing 2h τ=20MPa Resistivity 1-3×10-3 cm
Formula 25:
D-17 adhesive 618# 70 W-95 epoxy 30 polyvinyl butyral 7 600# thinner 10
CTBN 10 Phenylenediamine 20 2E4BZ 1.5 Reduction Silver 250-300
80°C, curing 2h τ=28MPa τ-52°C=29MPa τ100°C=25～28MPa τ150°C=7.5MPa
δ=74MPa The resistivity is 10-2 to 10-4cm
5, magnetic adhesive <br> formula twenty-six:
618# 185 Maleic anhydride 45 Hydroxy iron powder 770
Curing conditions: 125 ℃, 2h, suitable for transformer core glued <br> twenty-seven formula:
618# 100 Ferrite Powder (200 mesh) 20 DTA 10
Curing conditions: room temperature, 48H / 100 ℃, 2h, suitable for magnet glued <br> twenty-eight formula:
618# 100 Liquid Butyronitrile 15 Triethanolamine 15 Hydroxy Iron Powder 200-350
Curing conditions: 100 °C, 2h τ silicon steel> 18MPa
6, photosensitive adhesive <br> Photosensitive adhesive requires colorless, transparent, light-resistant, moisture-heat aging, curing shrinkage and high elongation, used to glue optical transparent components (chain) of the special glue.
Several chemical glue comparison Type Advantages Disadvantages Improvement measures Room temperature heating Organic silicones Good elasticity, high light transmittance, good resistance to aging, Low bonding strength Treatment of optical components with KH-550 Surface acrylic resin High optical shrinkage With KH-570 with polyurethane adhesive Optical and toughness are not good resistance to aging Add H12MDI improve epoxy glue good optical, good aging resistance, small elongation, small elongation with KH-560 treatment Note: H12MDI is hydrogenated 4,4 '-diisocyanate diphenyl alkane.
Formula 29:
GM-924 Photosensitive adhesive 711# Epoxy 60 Methyl methacrylate 40 Ï„AL/Perspex 6MPa
Curing conditions: 80W high-pressure chandeliers (distance 4 cm) Benzophenone 1.5 irradiation for 3 minutes. Suitable for bonding pieces of plexiglass <br> thirty formula:
Epoxy acrylate 100 DAP (ortho-benzoate) 30 benzoin Ether-ether DBP (dibutyl phthalate) 5
Ultraviolet radiation curing for 2 minutes, and ceramic peeling strength of 7.4MPa, bonding ceramic resonator LD and color TV, hydroquinone 0.075 delay line and so on.